The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 06, 2009

Filed:

Oct. 26, 2005
Applicant:

Xiantao Yan, San Jose, CA (US);

Inventor:

Xiantao Yan, San Jose, CA (US);

Assignee:

LedEngin, Inc. (Cayman), Grand Cayman, KY;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/18 (2006.01); H01L 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

LED packages are provided that can accommodate more than one type of LED. These packages include at least three bonding pads arranged such that two are appropriate for one type of LED, while another two are appropriate for another type of LED. Packages can include a thermally conductive layer on which the bonding pads and associated traces are disposed. The packages can also include electrical contacts on either of their top or bottom surfaces that are electrically coupled to the bonding pads by metallized vias or partial vias defined along edges or corners of the packages. Packages for multiple LEDs are also provided. These packages can enable the LEDs to be selectively operable.


Find Patent Forward Citations

Yan, Xiantao. (2009). High power led package with universal bonding pads and interconnect arrangement (U.S. Patent No. 7473933). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7473933

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…