The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 06, 2009
Filed:
Dec. 27, 2006
Keun-ho Kim, Daejeon, KR;
Dek-gin Yang, Chungcheongbuk-do, KR;
Jong-guk Kim, Daejeon, KR;
Il-kyoon Jeon, Paju-si, KR;
Eung-suek Lee, Ansan-si, KR;
Keun-Ho Kim, Daejeon, KR;
Dek-Gin Yang, Chungcheongbuk-do, KR;
Jong-Guk Kim, Daejeon, KR;
Il-Kyoon Jeon, Paju-si, KR;
Eung-Suek Lee, Ansan-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A printed circuit board and manufacturing method thereof are disclosed. A printed circuit board composed of an insulation substrate, which includes an insulation layer, a circuit pattern formed on one side of the insulation layer, and an interlayer passage joined to the insulation layer and configured to electrically connect with the circuit pattern, and a heat-release layer, which is stacked on the other side of the insulation layer to be stacked on the insulation substrate, can provide a high heat-releasing effect and high bending strength, by means of inner layers or ground layers formed by the heat-release layers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile