The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2008

Filed:

May. 23, 2006
Applicants:

Jian Xu, Singapore, SG;

Tong Liu, Singapore, SG;

Inventors:

Jian Xu, Singapore, SG;

Tong Liu, Singapore, SG;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of dynamically imaging, calibrating and measuring bump height and coplanarity of a plurality of bumps on a surface is disclosed. The method includes illuminating the plurality of bumps with multispectral light from at least one light source, and receiving light of a first wavelength at an imaging device such that a top view image of at least a portion of the plurality of bumps is captured. The light of the first wavelength is reflected off the plurality of bumps at a first angle from the surface. Light of a second wavelength is received at the imaging device such that at least one oblique side view image of at least a portion of the plurality of bumps is captured. The light of the second wavelength is reflected off the plurality of bumps at a second angle from the surface. The captured images are processed to determine absolute bump height and coplanarity. A corresponding apparatus is also disclosed.


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