The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 30, 2008

Filed:

Oct. 02, 2007
Applicants:

Vladimir Anatolyevich Aksyuk, Westfield, NJ (US);

Flavio Pardo, New Providence, NJ (US);

Maria Elina Simon, New Providence, NJ (US);

Inventors:

Vladimir Anatolyevich Aksyuk, Westfield, NJ (US);

Flavio Pardo, New Providence, NJ (US);

Maria Elina Simon, New Providence, NJ (US);

Assignee:

Lucent Technologies Inc., Murray Hill, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01H 61/01 (2006.01); H01L 23/58 (2006.01); H01L 31/04 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus comprising a microelectromechanical system (MEMS) device. The MEMS device includes a substrate having an anchoring pad thereon and a structural element. The structural element has a beam that includes a first part and a second part. The first part is attached to both the anchoring pad and to the second part. The second part is movable with respect to the substrate and made of an electrically conductive material. Additionally, at least one of the following conditions hold: the first part is made of a material having: a first yield stress that is greater than a second yield stress of the electrically conductive material of the second part; a fatigue resistance that is greater than a second fatigue resistance of the electrically conductive material of the second part; or, a creep rate that is less than a second creep rate of the electrically conductive material of the second part.


Find Patent Forward Citations

Loading…