The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Apr. 23, 2004
Yoshinari Tsukada, Sayama, JP;
Kimio Hachisuka, Sayama, JP;
Hiroshi Yarita, Sayama, JP;
Fumitomo Takano, Sayama, JP;
Yasuro Yamanaka, Sayama, JP;
Yoshinari Tsukada, Sayama, JP;
Kimio Hachisuka, Sayama, JP;
Hiroshi Yarita, Sayama, JP;
Fumitomo Takano, Sayama, JP;
Yasuro Yamanaka, Sayama, JP;
Honda Motor Co., Ltd., Tokyo, JP;
Abstract
A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between thermal expansion of the semiconductor element and thermal expansion of the heat sink arising due to heat produced by the semiconductor element. This thermal stress moderation reduces warping of the semiconductor device as a whole.