The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
May. 15, 2006
Barrett E. Cole, Bloomington, MN (US);
Robert E. Higashi, Shorewood, MN (US);
Christopher J. Zins, Inver Grove Heights, MN (US);
Subash Krishnankutty, North Haven, CT (US);
Barrett E. Cole, Bloomington, MN (US);
Robert E. Higashi, Shorewood, MN (US);
Christopher J. Zins, Inver Grove Heights, MN (US);
Subash Krishnankutty, North Haven, CT (US);
Honeywell International Inc., Morristown, NJ (US);
Abstract
A multi-substrate package assembly having a first substrate, a second substrate and a package, each with a number of bond pads. The package includes a cavity for receiving either or both of the first and second substrates, with a number of bond pads positioned along at least part of the periphery of the cavity. The first substrate and the second substrate are preferably positioned in the cavity of the package, with selected bond pads of the first substrate and second substrate electrically connected to selected bond pads of the package. In some embodiments, the bond pads of the first substrate are only connected to bond pads on one or more sides of the cavity, and the bond pads of the second substrate are only connected to bond pads on one or more of the remaining sides of the cavity. The packaging assembly of the present invention can be used in many applications, including spectrally tunable optical detectors.