The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Mar. 08, 2005
Hiroki Nikaido, Tochigi, JP;
Hirofumi Kuroda, Tochigi, JP;
Hiroki Nikaido, Tochigi, JP;
Hirofumi Kuroda, Tochigi, JP;
Sumitomo Bakelite Co., Ltd., Tokyo, JP;
Abstract
An objective of this invention is to provide an epoxy resin composition for encapsulating a semiconductor free from a harmful substance out of regard for the environment, which exhibits excellent soldering heat resistance and a higher productivity, as well as a semiconductor device manufactured by encapsulating therewith. This invention relates to a epoxy resin composition for encapsulating a semiconductor comprising, as essential components, (A) an epoxy resin having a particular structure and (B) a phenolic resin comprising a phenolic resin component having a particular structure as a main component, which contains a component having up to three aromatic rings in one molecule in 0.8% or less in an area ratio as determined by GPC analysis, as well as a semiconductor device manufactured by encapsulating a semiconductor chip with the composition.