The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Aug. 29, 2005
Toru Sugeno, Kanagawa-ken, JP;
Toru Sugeno, Kanagawa-ken, JP;
Canon Kabushiki Kaisha, Tokyo, JP;
Abstract
A method of forming a stacking structure by forming an electroconductive layer precursor pattern by an electroconductive paste made of a resin component, electroconductive fine particles, and glass fine particles, forming a dielectric layer precursor pattern by a dielectric paste made of a resin component and glass fine particles, and simultaneously baking both of those patterns, wherein they are held for a predetermined time while keeping a baking temperature which is equal to or higher than a decomposing temperature of the resin component and is equal to or lower than a baking start temperature of the glass fine particles and, thereafter, their baking is completed at the baking temperature which is equal to or higher than the baking start temperature of the glass fine particles and is lower than its softening point. Thus, the occurrence of a void and a pin hole in an insulative layer can be prevented in the stacking structure after the baking.