The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Oct. 05, 2005
Chang-soo Jang, Yongin-si, KR;
Dong-kwan Won, Yongin-si, KR;
Hyoung-ho Roh, Yongin-si, KR;
Jae-chul Ryu, Yongin-si, KR;
Chang-soo Jang, Yongin-si, KR;
Dong-kwan Won, Yongin-si, KR;
Hyoung-ho Roh, Yongin-si, KR;
Jae-chul Ryu, Yongin-si, KR;
Samsung Techwin Co., Ltd., Changwon, KR;
Abstract
Provided is a method of manufacturing a printed circuit board. In an embodiment, the method includes forming a prepreg layer via a reel method, forming a conductive film for forming a circuit pattern on at least one surface of the prepreg layer; and forming a predetermined circuit pattern on the conductive film. In an embodiment, the prepreg layer has a thickness of at most about 0.15 mm and contains a fiber material and a resin material. In an embodiment, the content of the resin material in the prepreg layer is about 70% or less by volume. In an embodiment, the prepreg layer is composed of at least one prepreg layer.