The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Mar. 30, 2004
Shinichi Nagaoka, Ichihara, JP;
Tomoo Hirota, Ichihara, JP;
Yoshiaki Togawa, Kyoto, JP;
Sumitomo Chemical Company, Limited, Osaka, JP;
Abstract
An object of the present invention is to achieve favorable injection molding with reduced mold clamping force required for molding and with suppression of weld line occurrence without repeating trial and error manually, by prompt calculation of adequate production parameters, when conducting injection molding of resin products. When the injection molding is conducted using a mold having a plurality of resin inflow conduits N, R, G, G, and Gto the cavity CV, the combination of a numerical analysis method for calculating the injection molding process and a computer-aided optimization method, derives the production parameters which determine time-sequentially the inflow of resin material through resin inflow conduits.