The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 23, 2008

Filed:

Mar. 11, 2005
Applicants:

Kouji Harada, Hitachinaka, JP;

Hiroatsu Tokuda, Hitachinaka, JP;

Kazuo Ojima, Hitachinaka, JP;

Masayuki Kobayashi, Mito, JP;

Inventors:

Kouji Harada, Hitachinaka, JP;

Hiroatsu Tokuda, Hitachinaka, JP;

Kazuo Ojima, Hitachinaka, JP;

Masayuki Kobayashi, Mito, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

A heat sink board having a first heat sink and a second heat sink with a smaller linear expansion coefficient than that of the first heat sink and being bonded to the first heat sink to form the heat sink board. The second heat sink is fitted to the first heat sink, and a material of the first heat sink in the vicinity of a boundary between the fitted heat sinks is plastically deformed for close adhesion to the second heat sink. A forming method makes bonding between the first and second heat sinks possible at room temperature, and the heat sink board made of a composite member having a high flat-surface accuracy can be easily and reliably obtained.


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