The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
May. 31, 2005
Andreas Thies, Berlin, DE;
Klaus Muemmler, Dresden, DE;
Andreas Thies, Berlin, DE;
Klaus Muemmler, Dresden, DE;
Qimonds AG, Munich, DE;
Abstract
A semiconductor substrate is provided comprising a plurality of contact pads arranged on a horizontal surface of the semiconductor substrate. Pillars of a first sacrificial material are formed on the contact pads. A first dielectric layer is deposited thus covering at least said pillars. A first conductive layer is deposited between said pillars covered with the first dielectric layer. The pillars are removed thus providing trenches in the first conductive layer having walls covered with the dielectric layer. A second conductive layer is deposited on the first dielectric layer in the trench. A second dielectric layer is deposited such that at least the second conductive layer in the trench is covered by the second dielectric layer. A third conductive layer is deposited on the second dielectric layer.