The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 23, 2008
Filed:
Nov. 10, 2004
Masashi Yamaura, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Nobuyoshi Maejima, Komoro, JP;
Mikio Negishi, Komoro, JP;
Tomio Yamada, Komoro, JP;
Tomomichi Koizumi, Komoro, JP;
Tsuneo Endoh, Komoro, JP;
Masashi Yamaura, Komoro, JP;
Hirokazu Nakajima, Saku, JP;
Nobuyoshi Maejima, Komoro, JP;
Mikio Negishi, Komoro, JP;
Tomio Yamada, Komoro, JP;
Tomomichi Koizumi, Komoro, JP;
Tsuneo Endoh, Komoro, JP;
Hitachi, Ltd., Tokyo, JP;
Abstract
A semiconductor device comprising semiconductor chips each formed with plural pads at the main surface, chip parts each formed with connection terminals at both ends thereof, a module substrate on which the semiconductor chips and the chip parts are mounted, solder connection portions for connecting the chip parts and the substrate terminals of the module substrate by soldering, gold wires for connecting the pads of the semiconductor chips and corresponding substrate terminals of the module substrate, and a sealing portion formed with a low elasticity resin such as an insulative silicone resin or a low elasticity epoxy resin for covering the semiconductor chips, chip parts, solder connection portions and gold wires which prevents flow out of the solder in the solder connection portion by re-melting thereby preventing short-circuit.