The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2008
Filed:
Sep. 24, 2003
Applicant:
Toshiharu Seko, Yamabe-gun, JP;
Inventor:
Toshiharu Seko, Yamabe-gun, JP;
Assignee:
Sharp Kabushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
Abstract
The semiconductor device uses an insulating resin that contains at least a resin anti-repellent for adjusting wettability of the insulating resin. The insulating resin is applied on a circuit board, and a semiconductor element is placed thereon and pressed against it. The applied pressure pushes out a portion of the insulating resin under the semiconductor element. This portion of the insulating resin combines with a portion of the insulating resin around the semiconductor element to form a resin fillet on the side surfaces of the semiconductor element.