The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2008
Filed:
Mar. 30, 2004
Shinichi Nagaoka, Ichihara, JP;
Tomoo Hirota, Ichihara, JP;
Yoshiaki Togawa, Kyoto, JP;
Sumitomo Chemical Company, Limited, Osaka, JP;
Abstract
An object of the present invention is to provide a method for designing a mold and a method for producing an injection molding in which a mold clamping force or weld line occurrence can be more accurately controlled in the case of injection molding of a resin product. In the case where an injection molding is carried out using a mold having a plurality of resin inflow conduits G, G, Gto a cavity CV, a mold design parameter in relation to at least one of the arrangement, the shapes and the sizes of the resin inflow conduits is determined by the combination of a numerical analysis method for calculating an injection molding process and a computer-aided optimization method, for the purpose of obtaining a preferable injection molding condition. Thereby the mold design parameter can be promptly and accurately calculated without repetition of trial and error manually.