The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 16, 2008
Filed:
Oct. 15, 2007
David L. Edwards, Poughkeepsie, NY (US);
Thomas Fleischman, Poughkeepsie, NY (US);
Paul A. Zucco, Saugerties, NY (US);
David L. Edwards, Poughkeepsie, NY (US);
Thomas Fleischman, Poughkeepsie, NY (US);
Paul A. Zucco, Saugerties, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for forming a heat spreading apparatus for semiconductor devices is disclosed. The method includes extruding a frame material to form multiple individual cells including fillable openings within the frame material; filling a first group of the individual cells with one or more high thermal conductivity materials; filling at least a second group of the individual cells with one or more materials of lower thermal conductivity than in the first group of the individual cells; and implementing a reflowing process following filling the multiple individual cells so as to infiltrate the materials within the individual cells, wherein defined walls of the frame material remain following the reflowing.