The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 09, 2008
Filed:
Aug. 28, 2006
Applicant:
Shuichi Miura, Yuri-gun, JP;
Inventor:
Shuichi Miura, Yuri-gun, JP;
Assignee:
TDK Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 1/02 (2006.01); H01B 1/12 (2006.01); H01B 1/08 (2006.01); H01B 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a conductive composition used for a conductor of an electronic component, comprising a metal particle and a metal oxide particle which has an average particle size of 5 to 60 nm, a melting point of 1500° C. or higher, and a content of 0.1 to 10.0 wt % based on the amount of the metal particle. According to the conductive composition, even when the metal particle is made fine, a sintering initiation temperature can be adequately increased, thus a generation of a crack and a de-lamination can be prevented easily and firmly.