The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7462027 B1

PDF
Full Text
Expired
Date of Patent:
Dec. 09, 2008

Filed:

May. 19, 2006
Applicant:

Yang-chang Chien, Tu-Cheng, TW;

Inventor:

Yang-Chang Chien, Tu-Cheng, TW;

Assignee:

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/30 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mold apparatus includes an upper mold having an upper molding plate and an upper molding core, and a bottom mold having a bottom molding plate for matching with the upper molding plate and a bottom molding core. One of the upper molding plate and the bottom molding plate defines a cavity and a corresponding one of the upper molding core and the bottom molding core is floatingly received and movable in the cavity.


Find Patent Forward Citations

Chien, Yang-Chang. (2008). Mold apparatus (U.S. Patent No. 7462027). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7462027

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