The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
May. 07, 2003
Kazuhiro Hayashi, Osaka, JP;
Kazuya Hisada, Osaka, JP;
Kazuhiro Higashimaru, Osaka, JP;
Eiji Ohno, Osaka, JP;
Kazuhiro Hayashi, Osaka, JP;
Kazuya Hisada, Osaka, JP;
Kazuhiro Higashimaru, Osaka, JP;
Eiji Ohno, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A transfer layer on a surface of a mold has a thickness distribution along the radius direction that the layer is thick in an inner round portion but is gradually thinner toward an outer round portion. An adhesive layer is formed between a surface of a signal substrate which bears a signal recording film and the mold which seats the transfer layer. The adhesive layer has a thickness distribution that the layer is thin in an inner round portion but is gradually thicker toward an outer round portion. Since the thickness distributions along the radius direction of the transfer layer and the adhesive layer are opposite to each other, the thickness distribution of an isolation layer which comprises the two layers is uniform.