The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Nov. 30, 2004
Hiromi Hyuga, Aichi-ken, JP;
Koichi Ueno, Aichi-ken, JP;
Nobuyoshi Baba, Aichi-ken, JP;
Daiichiro Kawashima, Aichi-ken, JP;
Hiromi Hyuga, Aichi-ken, JP;
Koichi Ueno, Aichi-ken, JP;
Nobuyoshi Baba, Aichi-ken, JP;
Daiichiro Kawashima, Aichi-ken, JP;
Toyoda Gosei Co., Ltd., Aichi-pref., JP;
Abstract
A method for molding an in-mold coating product including a substrate and a coating formed on a surface of the substrate. A first mold including a fixed mold piece is closed to form a substrate cavity therein. The substrate cavity is charged with a resin to form the substrate with a seal projection formed near the parting line of the first mold. Then, a second mold, which uses the fixed mold piece of the first mold, is closed with the substrate arranged on the fixed mold piece to form a coating cavity therein. The second mold deforms the seal projection so that when a coating material is charged into the coating cavity, the coating material does not leak out toward the parting line of the second mold.