The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
Aug. 02, 2005
Masahiro Usuki, Kashima-gun, JP;
Makoto Fujiwara, Kashima-gun, JP;
Shigehiro Hoshida, Kashima-gun, JP;
Michio Aizawa, Kashima-gun, JP;
Tadashi Amano, Kashima-gun, JP;
Masahiro Usuki, Kashima-gun, JP;
Makoto Fujiwara, Kashima-gun, JP;
Shigehiro Hoshida, Kashima-gun, JP;
Michio Aizawa, Kashima-gun, JP;
Tadashi Amano, Kashima-gun, JP;
Shin-Etsu Chemical Co., Ltd., Tokyo, JP;
Abstract
A flexible metal foil/polyimide laminate is prepared by applying a polyamic acid varnish onto a very thin copper foil on a carrier, semi-drying the varnish, laminating a polyimide film to the varnish-coated copper foil using a hot roll press, and heat treating the laminate for solvent removal and imidization in an atmosphere having a controlled oxygen concentration. A polyimide adhesive layer resulting from the imidization of polyamic acid has a thickness of up to 6 μm, the sum of the thicknesses of the polyimide film and the polyimide adhesive layer is up to 25 μm. The polyimide adhesive layer has a Tg>400° C.