The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 02, 2008

Filed:

Jul. 24, 2006
Applicant:

Ming-chiang Tsai, Tu-Cheng, TW;

Inventor:

Ming-Chiang Tsai, Tu-Cheng, TW;

Assignee:

Hon Hai Precision Industry Co., Ltd., Tu-Cheng, Taipei Hsien, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 33/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A mold assembly () is described that includes an upper mold (), a lower mold () and a plurality of adjusting members (). The upper mold includes an upper mold core (). The lower mold includes a lower mold carrier () and a lower mold core (). The lower mold carrier includes a plurality of sidewalls (), which cooperatively define an opening () and have a plurality of screw holes () defined therethrough in communication with the receiving cavity. The lower mold core is received in the receiving cavity with a clearance formed therebetween. The adjusting member engages in the screw holes for aligning the lower mold core with the lower mold carrier.


Find Patent Forward Citations

Tsai, Ming-Chiang. (2008). Mold assembly (U.S. Patent No. 7458797). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7458797

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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