The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2008
Filed:
May. 22, 2006
Akira Morii, Hiroshima, JP;
Akira Morii, Hiroshima, JP;
The Japan Steel Works, Ltd., Tokyo, JP;
Abstract
A mold clamping apparatus of an injection molding machine, which includes a fixed platen to which a fixed-side mold is attached, a mold clamping housing, a plurality of tie bars provided between the fixed platen and the mold clamping housing and a movable platen to which a moving-side mold is attached and which is capable of moving with respect to the fixed platen along the tie bars. The mold clamping apparatus includes heaters for heating the tie bars and sensors for sensing the temperatures of portions heated by the heaters, and the heaters and the sensors are provided to each of the plurality of tie bars. The mold clamping apparatus includes a temperature adjustor, which is connected to the heaters and the sensors and controls the temperatures of the heated portions of the tie bars.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile