The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2008

Filed:

Feb. 14, 2005
Applicants:

Seiichi Chiba, Minowa-machi, JP;

Katsuhiko Miyazaki, Minowa-machi, JP;

Mutsuo Hayashi, Minowa-cho, JP;

Inventors:

Seiichi Chiba, Minowa-machi, JP;

Katsuhiko Miyazaki, Minowa-machi, JP;

Mutsuo Hayashi, Minowa-cho, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 41/08 (2006.01);
U.S. Cl.
CPC ...
Abstract

A piezo-electric oscillator has a reduced manufacturing cost using a general purpose piezo-electric vibrator, while coping with miniaturization. The piezo-electric oscillator has resin; a substrate having an upper face, a bottom face, a conductive terminal portion, and a mounting terminal portion at the bottom face; and a piezo-electric vibrator including a package, a conductive portion, a cover plate, a piezo-electric vibration piece, an external terminal portion; and an oscillation circuit element having an oscillation circuit. The piezo-electric vibration piece is housed within the package and, the package is fixed to the upper face of the substrate and sealed with the cover plate. The external terminal portion at a surface of the package is electrically coupled with the piezo-electric vibration piece and, at least the conductive portion excluding the mounting terminal portion is sealed with the resin. The oscillation circuit element is fixed to a face of the package opposite to the substrate. The conduction terminal portion on the upper face of the substrate is electrically coupled with the mounting terminal portion, and the external terminal portion and the conduction terminal portion are electrically coupled with the oscillation circuit element.


Find Patent Forward Citations

Loading…