The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Mar. 20, 2006
Shinji Murata, Fukushima-ken, JP;
Masayoshi Takeuhi, Fukushima-ken, JP;
Shinji Murata, Fukushima-ken, JP;
Masayoshi Takeuhi, Fukushima-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
There is provided a structure for mounting a semiconductor part having improved productivity, in which a bump is detached from a land portion and a method of manufacturing a mounting substrate used therein. The structure for mounting the semiconductor part includes a mounting substratehaving an insulating substrateon which a wiring patternand a land portionare provided, a semiconductor partmounted on the mounting substrateusing a bumpand the land portion, and an underfillinserted between the semiconductor partand the insulating substrate. An undercut portionhaving an inverse tapered shape from the insulating substrateto an upper surface of the land portionis provided in an edgeof the land portionin which the bumpis located, and the bump is inserted into the undercut portion. Accordingly, since the couple between the bumpand the land portionbecomes stronger, the bump is not detached from the land portionwhen the underfillexpands or contracts.