The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Nov. 30, 2004
Hiroyuki Fujiwara, Hachioji, JP;
Takahito Suzuki, Hachioji, JP;
Susumu Chihara, Hachioji, JP;
Mitsuhiko Ogihara, Hachioji, JP;
Ichimatsu Abiko, Tokyo, JP;
Masaaki Sakuta, Tokyo, JP;
Hiroyuki Fujiwara, Hachioji, JP;
Takahito Suzuki, Hachioji, JP;
Susumu Chihara, Hachioji, JP;
Mitsuhiko Ogihara, Hachioji, JP;
Ichimatsu Abiko, Tokyo, JP;
Masaaki Sakuta, Tokyo, JP;
Oki Data Corporation, Tokyo, JP;
Abstract
A semiconductor apparatus has a substrate to which is attached a thin semiconductor film including at least one semiconductor device. An interconnecting line links the semiconductor film with electrical circuitry on the substrate. The interconnecting line includes a pad located on the substrate, between the thin semiconductor film and the electrical circuitry. The pad, which is wider than other parts of the interconnecting line, can be used as a probe pad for testing the apparatus, and in particular for testing the electrical circuitry on the substrate before the thin semiconductor film is attached.