The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Oct. 17, 2006
Hyuk Min Lee, Seoul, KR;
Hyoun Soo Shin, Seoul, KR;
Chang Wan Kim, Suwon, KR;
Yong Chun Kim, Suwon, KR;
Hyuk Min Lee, Seoul, KR;
Hyoun Soo Shin, Seoul, KR;
Chang Wan Kim, Suwon, KR;
Yong Chun Kim, Suwon, KR;
Samsung Electro-Mechanics Co., ltd., Gyunggi-Do, KR;
Abstract
A nitride-based semiconductor LED which is flip-chip bonded on a lead pattern of a sub-mount through a bump ball comprises a substrate; a light-emitting structure formed on the substrate; an electrode formed on the light-emitting structure; a protective film formed on the resulting structure having the electrode formed therein, the protective film exposing the electrode surface corresponding to a portion which is connected to the lead pattern of the sub-mount through a bump ball; and a grid-shape buffer film formed on the electrode surface exposed through the protective film.