The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Jul. 27, 2004
Ivan Eliashevich, Maplewood, NJ (US);
Boris Kolodin, Beachwood, OH (US);
Emil P. Stefanov, Altbach, DE;
Ivan Eliashevich, Maplewood, NJ (US);
Boris Kolodin, Beachwood, OH (US);
Emil P. Stefanov, Altbach, DE;
Lumination LLC, Valley View, OH (US);
Abstract
In a method for fabricating a flip-chip light emitting diode device, epitaxial layers () are deposited on a growth substrate () to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die (). The device die () is flip chip bonded to a mount (). The flip chip bonding includes securing the device die () to the mount () by bonding at least one electrode () of the device die () to at least one bonding pad () of the mount (). Subsequent to the flip chip bonding, a thickness of the growth substrate () of the device die () is reduced.