The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 25, 2008

Filed:

Dec. 03, 2004
Applicants:

Kazuyuki Nakanishi, Seto, JP;

Tadashi Oshima, Aichi-gun, JP;

Hideo Hasegawa, Nagoya, JP;

Hiroyuki Mori, Nisshin, JP;

Takashi Iseki, Nisshin, JP;

Hideo Tachikawa, Nisshin, JP;

Munehisa Matsui, Toyota, JP;

Inventors:

Kazuyuki Nakanishi, Seto, JP;

Tadashi Oshima, Aichi-gun, JP;

Hideo Hasegawa, Nagoya, JP;

Hiroyuki Mori, Nisshin, JP;

Takashi Iseki, Nisshin, JP;

Hideo Tachikawa, Nisshin, JP;

Munehisa Matsui, Toyota, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a soft amorphous carbon exhibiting a low elastic modulus, an amorphous-carbon coated member provided with a coated film comprising the amorphous carbon, and a process for forming an amorphous carbon film. The amorphous carbon comprises carbon as a major component and hydrogen in an amount of from more than 30 atomic % to 60 atomic % or less, and exhibits an elastic modulus of from 40 or more to 150 GPa or less. Moreover, the amorphous-carbon coated member comprises a conductive substrate, and a coated film fixed on at least a part of a surface of the substrate and composed of the amorphous carbon. In addition, in a process for forming the amorphous-carbon coated film, an amorphous carbon film is formed on a surface of conductive substrates by a plasma CVD method. Not only a plurality of the substrates are disposed on a substrate holder, which is disposed in a film-forming furnace and is connected with a negative electrode, in such a state that they face to each other, but also a processing gas pressure and a plasma power source are operated so as to overlap negative glows of the neighboring two substrates.


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