The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Nov. 29, 2004
Takatomo Yamaguchi, Toyama, JP;
Kazuhiro Morimitsu, Toyama, JP;
Takatomo Yamaguchi, Toyama, JP;
Kazuhiro Morimitsu, Toyama, JP;
Hitachi Kokusai Electric Inc., Tokyo, JP;
Abstract
A nonuniform portion of a film thickness on a substrate owing to effects of a support column, a substrate mounting portion, and the like which constitute a substrate holder is eliminated, and uniformity of the film thickness of the substrate is enhanced. A substrate processing apparatus houses plural wafers (substrates) held on a boat (substrate holder) in a processing chamber, supplying processing gas to the heated processing chamber, thereby performing film-forming processing for the wafers. The boat includes: at least three support columnsprovided substantially vertically; plural wafer support portions(substrate mounting portions) which are provided at multi-stages on the support columns and mount the plural wafers substantially horizontally at a predetermined interval; and plural ring-like platesarranged on the support columns, and provided substantially horizontally at a predetermined interval with respect to the wafers supported on the wafer support portions