The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2008
Filed:
Oct. 01, 2004
Applicant:
Yoshihide Nishiyama, Chino, JP;
Inventor:
Yoshihide Nishiyama, Chino, JP;
Assignee:
Seiko Epson Corporation, , JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01);
U.S. Cl.
CPC ...
Abstract
An apparatusA for manufacturing semiconductor devices includes a plurality of receiving portionsfor receiving an upper semiconductor packageon a top surface of the receiving portion. The receiving portion has a function of restricting the movement of the upper semiconductor packagein a direction parallel to a top surface of the upper semiconductor package. The receiving portionis a concave portion in which the upper semiconductor packageis adapted to be received. An adhesive material having a function of immovably holding the upper semiconductor packageto the receiving portionmay be provided within the receiving portion, for example.