The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 18, 2008

Filed:

Jul. 17, 2007
Applicants:

Jeffrey A. Ketterling, New York, NY (US);

Mary Lizzi, Legal Representative, Tenafly, NJ (US);

Inventors:

Jeffrey A. Ketterling, New York, NY (US);

Mary Lizzi, legal representative, Tenafly, NJ (US);

Assignee:

Riverside Research Institute, New York, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04R 25/00 (2006.01); H04R 31/00 (2006.01); H01G 9/00 (2006.01); H04L 41/22 (2006.01); H01L 41/00 (2006.01); H02N 2/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Techniques for fabricating high frequency ultrasound transducers are provided herein. In one embodiment, the fabrication includes depositing a copperclad polyimide film, a layer of epoxy on the copperclad polyimide film, and a polyvinylidene fluoride film on the epoxy. The assembly of materials are then pressed to bond the polyvinylidene fluoride film to the copperclad polyimide film and to form an assembly. The polyvinylidene fluoride film being one surface and the copperclad polyimide film being the other surface. The area behind the copperclad polyimide film surface is filled with a second epoxy, and then cured to form an epoxy plug.


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