The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Mar. 29, 2006
Atsushi Saita, Kobe, JP;
Toshikazu Imaoka, Ogaki, JP;
Tetsuro Sawai, Hashima, JP;
Yasunori Inoue, Ogaki, JP;
Atsushi Saita, Kobe, JP;
Toshikazu Imaoka, Ogaki, JP;
Tetsuro Sawai, Hashima, JP;
Yasunori Inoue, Ogaki, JP;
Sanyo Electric Co., Ltd., Osaka, JP;
Abstract
The ground noise is reduced which propagates between circuit elements in a circuit device having a multiple stack structure. A grounding bonding pad provided on the surface of a second circuit element is connected to a bonding wire provided on the surface of a conduction layer via a grounding wire such as gold. A bonding pad provided on the surface of the conductive layer is connected to a lead provided on a ground wire via a grounding wire such as gold. This structure creates a capacitance between the second circuit element and the conduction layer so as to prevent the propagation of noise circuit from element to the ground wiring.