The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Jul. 20, 2006
Yong Suk Kim, Kyungki-do, KR;
Young Soo OH, Kyungki-do, KR;
Hyoung Ho Kim, Kyungki-do, KR;
Taek Jung Lee, kyungki-do, KR;
Seog Moon Choi, Seoul, KR;
Yong Suk Kim, Kyungki-do, KR;
Young Soo Oh, Kyungki-do, KR;
Hyoung Ho Kim, Kyungki-do, KR;
Taek Jung Lee, kyungki-do, KR;
Seog Moon Choi, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd., Kyungki-Do, KR;
Abstract
The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.