The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7452729 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 18, 2008

Filed:

Jul. 03, 2003
Applicant:

Masahiro Yamagata, Takasago, JP;

Inventor:

Masahiro Yamagata, Takasago, JP;

Assignee:

Kobe Steel, Ltd, Kobe-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 30/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method for processing a waste high-pressure fluid, which is yielded by bringing a high-pressure fluid into contact with a processing object in a high-pressure processing vessel to make unnecessary materials on the processing object accompany it. In accordance with the present invention, a novel processing method is provided which includes the steps of draining liquid ingredients, which is obtained from a preliminarily refined waste medium-pressure fluid, having been decompressed from the waste high-pressure fluid and provided to a separating means filled with packing materials, out of a system with unnecessary materials, and refining gas ingredients, which is also obtained from the preliminarily refined waste medium-pressure fluid, in an adsorbing means including adsorbents.


Find Patent Forward Citations

Yamagata, Masahiro. (2008). Waste high-pressure fluid processing method (U.S. Patent No. 7452729). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7452729

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…