The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Apr. 26, 2006
Shinji Murata, Fukushima-ken, JP;
Shinji Murata, Fukushima-ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
Provided is a wiring portion capable of suppressing diffusion from occurring in a wiring portion or between the wiring portion and a substrate. In the wiring substrate, a first high melting point metal portionhaving a melting point higher than Au and Ag is provided between an Au wiring portionand an Ag wiring portion. The higher the melting point of the first high melting point metal portion, the lower a coefficient thereof, that is, the harder diffusion occurs. In addition, the first high melting point metal portionfunctions as a barrier material which adequately suppresses Ag from being diffused from the Ag wiring portion. By providing the first high melting point metal portionbetween the Au wiring portionand the Ag wiring portion, it is possible to more efficiently suppress Ag from diffusion, in comparison with a case where the Ag wiring portion and the Au wiring portion are in contact with each other.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile