The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2008

Filed:

Feb. 25, 2005
Applicants:

Motomichi Itou, Nagoya, JP;

Yukio Miyairi, Nagoya, JP;

Inventors:

Motomichi Itou, Nagoya, JP;

Yukio Miyairi, Nagoya, JP;

Assignee:

NGk Insulators, Ltd., Nagoya, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 17/50 (2006.01); B81B 7/00 (2006.01); E04C 2/34 (2006.01); E04C 1/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for analysis of a cell structure includes a macroanalysis step and a microanalysis step. The macroanalysis step includes replacing a cell structure or a part of the cell structure with an anisotropic solid body having property values of equivalent rigidity characteristics, creating a finite element model of the anisotropic solid body based on the property values, applying an internal temperature distribution or an external pressure to the finite element model of the anisotropic solid body, determining the stress distribution in the anisotropic solid body, and selecting an aimed cell structure of which the stress should be calculated as a cell structure based on the stress distribution. The microanalysis step includes creating a finite element model of the aimed cell structure, and determining the stress distribution in the aimed cell structure based on the finite element model of the aimed cell structure. The structural analysis method is a means for analyzing the stress distribution in the cell structure due to the internal temperature distribution or external pressure which can be realized by using general-purpose computer software and hardware without performing a simulation test and making a large investment.


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