The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Mar. 19, 2003
Dale C. Flanders, Lexington, MA (US);
Walid Atia, Lexington, MA (US);
Eric E. Fitch, Medford, MA (US);
Minh Van Le, Methuen, MA (US);
Randal A. Murdza, North Andover, MA (US);
Robert L. Payer, Pepperell, MA (US);
Jeffrey A. Korn, Lexington, MA (US);
Xiaomei Wang, Winchester, MA (US);
Walter R. Buchwald, Hampstead, NH (US);
L. James Newman, Iii, Sudbury, MA (US);
Dale C. Flanders, Lexington, MA (US);
Walid Atia, Lexington, MA (US);
Eric E. Fitch, Medford, MA (US);
Minh Van Le, Methuen, MA (US);
Randal A. Murdza, North Andover, MA (US);
Robert L. Payer, Pepperell, MA (US);
Jeffrey A. Korn, Lexington, MA (US);
Xiaomei Wang, Winchester, MA (US);
Walter R. Buchwald, Hampstead, NH (US);
L. James Newman, III, Sudbury, MA (US);
Axsun Technologies, Inc., Billerica, MA (US);
Abstract
A detector system for a fiber optic component is insensitive to stray light. Specifically, the invention comprises a detector chip, which converts received light into an electric signal. A baffle substrate is positioned over the detector chip. This baffle substrate has a transmission port through which an optical signal is transmitted to the detector chip. As a result, light that is not directed to be transmitted through the port is blocked by the baffle substrate. In this way, it rejects stray light that may be present in the hermetic package. A detector substrate is provided on which the detector chip is mounted. This detector substrate preferably comprises electrical traces to which the detector chip is electrically connected. The detector substrate can further comprise bond pads for wire bonding to make electrical connections to the electrical traces.