The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Mar. 06, 2007
Applicants:
Thilo Stolze, Arnsberg, DE;
Richard Boettcher, Warstein, DE;
Inventors:
Thilo Stolze, Arnsberg, DE;
Richard Boettcher, Warstein, DE;
Assignee:
Infineon Technologies AG, , DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
A power semiconductor module has a heat-dissipation contact surface () for a thermally conductive connection to a cooling element (). The module can be simply, cost-effectively and reliably fixed to the cooling element for the conduction of heat to the latter by at least one pressure element () which is permanently connected to the power semiconductor module. When mounted, the pressure element () presses the heat-dissipation contact surface () against the cooling element ().