The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2008

Filed:

Mar. 14, 2005
Applicants:

Andrew David White, Brooklyn Park, MN (US);

Roger Lee Hipwell, Jr., Eden Prairie, MN (US);

John R. Pendray, Edina, MN (US);

Bradley Jay Vermeer, Savage, MN (US);

Inventors:

Andrew David White, Brooklyn Park, MN (US);

Roger Lee Hipwell, Jr., Eden Prairie, MN (US);

John R. Pendray, Edina, MN (US);

Bradley Jay VerMeer, Savage, MN (US);

Assignee:

Seagate Technology LLC, Scotts Valley, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/48 (2006.01); G11B 5/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composite head-electrical conditioner assembly that includes a slider with a transducer head and transducer bond pads. The transducer bond pads communicate a transducer level electrical signal with the transducer head. An integrated circuit substrate has a conditioning circuit and first substrate bond pads electrically connected to the transducer bond pads. The integrated circuit substrate has second substrate bond pads with a conditioned electrical signal that is transmittable over a circuit. The slider is rigidly mounted to the integrated circuit substrate to form an assembly that is flexibly mountable. A thermal isolation space is provided between the transducer and the conditioning circuit. The integrated circuit can be in the form of a cap that provides windage reduction.


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