The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2008

Filed:

Dec. 14, 2006
Applicants:

Hidetoshi Nakanishi, Tokyo, JP;

Toshitaka Sekine, Tokyo, JP;

Taichi Obara, Tokyo, JP;

Inventors:

Hidetoshi Nakanishi, Tokyo, JP;

Toshitaka Sekine, Tokyo, JP;

Taichi Obara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 31/0203 (2006.01);
U.S. Cl.
CPC ...
Abstract

The power semiconductor apparatus includes a resin package made up of a power semiconductor element and a control semiconductor element which are mounted on a main front surface of a lead frame and sealed with mold resin, a power terminal led out of the resin package and electrically connected to the power semiconductor element, a control terminal led out of the resin package and electrically connected to the control semiconductor element and a cylindrical case which is formed in a manner separable from the resin package and encloses the resin package, wherein the power terminal and the control terminal are led out of lead insertion slots formed in the case, and a part of the power terminal which is led out of the case is bent along an end face of the case.


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