The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Jun. 05, 2007
Ming-yao Chen, Taipei, TW;
Sheng-shu Yang, Hsinchu, TW;
Shyh-ming Chang, Hsinchu, TW;
Ngai Tsang, Tainan, TW;
Ming-Yao Chen, Taipei, TW;
Sheng-Shu Yang, Hsinchu, TW;
Shyh-Ming Chang, Hsinchu, TW;
Ngai Tsang, Tainan, TW;
Taiwan TFT LCD Association, Hsinchu, TW;
Chunghwa Picture Tubes, LTD., Taoyuan, TW;
Au Optronics Corporation, Hsinchu, TW;
Hannstar Display Corporation, Taipei, TW;
Chi Mei Optoelectronics Corporation, Tainan County, TW;
Industrial Technology Research Institute, Hsinchu, TW;
TPO Displays Corp., Miao-Li County, TW;
Abstract
A bump structure on a substrate including at least one first electrode, at least one first bump, at least one second bump is provided. The first electrode is disposed on the substrate. The first bump is disposed on the first electrode. The second bump is disposed on the substrate. The height of the second bump is greater than that of the first bump. The elastic bump of the present invention can be used for measuring the bonding process quality.