The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 11, 2008

Filed:

Jun. 29, 2006
Applicants:

David P. Adams, Albuquerque, NM (US);

Michael B. Sinclair, Albuquerque, NM (US);

Thomas M. Mayer, Albuquerque, NM (US);

Michael J. Vasile, Albuquerque, NM (US);

William C. Sweatt, Albuquerque, NM (US);

Inventors:

David P. Adams, Albuquerque, NM (US);

Michael B. Sinclair, Albuquerque, NM (US);

Thomas M. Mayer, Albuquerque, NM (US);

Michael J. Vasile, Albuquerque, NM (US);

William C. Sweatt, Albuquerque, NM (US);

Assignee:

Sandia Corporation, Albuquerque, NM (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G21K 5/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and apparatus whereby an optical interferometer is utilized to monitor and provide feedback control to an integrated energetic particle column, to create desired topographies, including the depth, shape and/or roughness of features, at a surface of a specimen. Energetic particle columns can direct energetic species including, ions, photons and/or neutral particles to a surface to create features having in-plane dimensions on the order of 1 micron, and a height or depth on the order of 1 nanometer. Energetic processes can include subtractive processes such as sputtering, ablation, focused ion beam milling and, additive processes, such as energetic beam induced chemical vapor deposition. The integration of interferometric methods with processing by energetic species offers the ability to create desired topographies at surfaces, including planar and curved shapes.


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