The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 11, 2008
Filed:
Feb. 24, 2006
Richard J. Webb, Inver Grove Heights, MN (US);
John C. Clark, White Bear Lake, MN (US);
Christopher J. Rueb, St. Paul, MN (US);
John J. Gagliardi, Hudson, WI (US);
Richard J. Webb, Inver Grove Heights, MN (US);
John C. Clark, White Bear Lake, MN (US);
Christopher J. Rueb, St. Paul, MN (US);
John J. Gagliardi, Hudson, WI (US);
3M Innovative Properties Company, St. Paul, MN (US);
Abstract
A method for polishing a wafer comprising an aqueous solution having a pH in the range of 6 to 8, wherein the aqueous solution comprises at least one compound selected from the group consisting of a polymethacrylic acid, a polysulfonic acid, and combinations thereof, and wherein the compound is present in the range of 1.5 to 4 percent by weight of the aqueous solution. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.