The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7447041 B1

PDF
Full Text
Expired
Date of Patent:
Nov. 04, 2008

Filed:

Mar. 01, 2007
Applicants:

Scott D. Brandenburg, Kokomo, IN (US);

Thomas A. Degenkolb, Noblesville, IN (US);

Shing Yeh, Kokomo, IN (US);

Inventors:

Scott D. Brandenburg, Kokomo, IN (US);

Thomas A. Degenkolb, Noblesville, IN (US);

Shing Yeh, Kokomo, IN (US);

Assignee:

Delphi Technologies, Inc., Troy, MI (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements.


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Brandenburg, Scott. (2008). Compression connection for vertical ic packages (U.S. Patent No. 7447041). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7447041

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