The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Sep. 05, 2006
Applicant:
Shuhei Ishikawa, Handa, JP;
Inventor:
Shuhei Ishikawa, Handa, JP;
Assignee:
NGK Insulators, Ltd., Nagoya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract
A heat spreader module is composed of a joined assembly, including a plate member, an insulating board disposed on the plate member, and a circuit board disposed on the insulating board. An IC chip is mounted on an upper surface of the joined assembly, or stated otherwise, on an upper surface of the circuit board, with a solder layer interposed therebetween. A heat sink is joined by a solder layer, for example, onto a lower surface of the joined assembly, or stated otherwise, onto a lower surface of the plate member, thereby making up a heat sink module.