The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Jan. 14, 2005
Annayya P. Deshpande, San Jose, CA (US);
Calvin Shyhjong Lo, Saratoga, CA (US);
Kevin Thuy Luong, San Jose, CA (US);
Artemio Juan Torres, Milpitas, CA (US);
Annayya P. Deshpande, San Jose, CA (US);
Calvin Shyhjong Lo, Saratoga, CA (US);
Kevin Thuy Luong, San Jose, CA (US);
Artemio Juan Torres, Milpitas, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic component according to one embodiment comprises a portion of a row cut from a wafer; and a closure coupled to the portion of the row of the wafer towards a first edge of the portion of the row of the wafer; the portion of the row of the wafer having a bonding area positioned adjacent a second edge of the portion of the row of the wafer, the second edge of the portion of the row of the wafer being positioned opposite the first edge of the portion of the row of the wafer and along a same side thereof, wherein the bonding area includes a layer of adhesive thereon, wherein the adhesive coupled to the bonding area is spaced from the closure. Additional systems and methods are also presented.