The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2008

Filed:

Nov. 02, 2005
Applicant:

Wen-ping Huang, Tucheng, Taupei Hsien, Taipei Hsien, TW;

Inventor:

Wen-Ping Huang, Tucheng, Taupei Hsien, Taipei Hsien, TW;

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A designing for a power semiconductor, and especially to a structure of a power semiconductor formed by using the basic materials including two metal plates and a ceramic plate, in the power semiconductor, mainly surfaces of the ceramic base plate provided with a receiving groove is metallized, and the metallic base plates having electric connecting pins extending outwards therefrom are placed at the two lateral sides of the ceramic base plate, then a chip is placed in the receiving groove of the ceramic base plate, and the ceramic base plate is sintered together with the two metallic base plates, thus the structure of the power semiconductor with the twin metal plates and the ceramic plate is formed.


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