The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 04, 2008
Filed:
Sep. 27, 2002
Michael Fehrer, Bad Abbach, DE;
Volker Harle, Waldetzenberg, DE;
Frank Kuhn, Munich, DE;
Ulrich Zehnder, Regensburg, DE;
Michael Fehrer, Bad Abbach, DE;
Volker Harle, Waldetzenberg, DE;
Frank Kuhn, Munich, DE;
Ulrich Zehnder, Regensburg, DE;
Osram Opto Semiconductors GmbH, Regensburg, DE;
Abstract
A radiation-emitting semiconductor chip, having a multilayer structure () containing a radiation-emitting active layer (), and having a window layer (), which is transmissive to a radiation emitted by the active layer () and is arranged downstream of the multilayer structure () in the direction of a main radiating direction of the semiconductor component. The window layer () has at least one peripheral side area (), which, in the course from a first main area () facing the multilayer structure () in the direction toward a second main area () remote from the multilayer structure (), firstly has a first side area region () which is beveled, curved or stepped in such a way that the window layer widens with respect to the size of the first main area (). A peripheral side area () of the multilayer structure () and at least a part of the beveled, curved or stepped first side area region () are coated with a continuous electrically insulating layer (). A radiation-emitting component is disclosed having a chip of this type, and also disclosed is a method for simultaneously producing a multiplicity of such chips.