The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 04, 2008

Filed:

Feb. 08, 2006
Applicants:

Mikio Tazima, Suginami-ku, JP;

Tetsuji Moku, Asaka, JP;

Junji Sato, Saitama, JP;

Yasuhiro Kamii, Fujimino, JP;

Arei Niwa, Fujimino, JP;

Inventors:

Mikio Tazima, Suginami-ku, JP;

Tetsuji Moku, Asaka, JP;

Junji Sato, Saitama, JP;

Yasuhiro Kamii, Fujimino, JP;

Arei Niwa, Fujimino, JP;

Assignee:

Sanken Electric Co., Ltd., Saitama-ken, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/15 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a semiconductor light emitting diode and a method of manufacturing the same that enable voltage in the forward direction to be decreased while allowing light extraction efficiency to be improved. This semiconductor light emitting diode is formed by a substrate, a light emitting portion that is disposed on one main surface of the substrate, a first electrode that is disposed on the light emitting portion, a pad electrode that is disposed on the first electrode, concave portions that are formed on at least a portion of the one main surface of the substrate, and a conductive layer that is formed from a conductive material that is disposed in the concave portions and reflects light emitted from the light emitting portion.


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